newsletter

2026 Monthly San Diego IEEE EXCOM - July Meeting - San Diego Section on 15-July-2026
SDIEEE EXCOM Meeting Executive Committee meeting to discuss all San Diego IEEE activities. All IEEE members welcome to attend. Please RSVP. 5:30 pm - 6:00 pm, Networking and food! 6:00 pm - 8:00 pm, meeting (in person and/or remote) Meeting Adjourned To add to the agenda, please email upalmahbub@yahoo.com.
The Data-Centric Workflow, Now With an Agent - San Diego Section Chapter, C16 on 21-July-2026
6th Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)
IEEE/CN - July 2026 Meeting "From Hidden IP Value to Courtroom Proof" - Shahram Shafie, MS ECE - San Diego Section Affinity Group,CN on 20-July-2026
Monday, July 20, 2026 5:30pm – 7:30 pm IEEE Consultants' Network: JULY 2026 Meeting ("Home Base") From Hidden IP Value to Courtroom Proof:A Silicon-to-System Framework for IP Evaluation Shahram Shafie, MS ECE Engineering Expert Network: Antenna, ASIC, Algorithm | 4G/5G/6G, Radar, Wi‑Fi, SATCOM | Patent Litigation SME Sourcing & Expert Witness Support | […]
2026 GET-AI SERIES: 4 . Driving Business Efficiency with AI - Orange County Section Chapter, EMB18 on 27-July-2026
Artificial Intelligence is rapidly transforming how organizations generate revenue, streamline operations, and automate complex business processes. From intelligent sales prospecting and personalized customer engagement to autonomous AI agents capable of reasoning, planning, and executing multi-step workflows, AI is becoming an essential driver of business efficiency and competitive advantage. Following our June session on AI-Powered […]
IEEE Electronic Packaging Design and Characterization Summer School 2026 - San Diego Section Chapter, EP21 on 11-August-2026
The IEEE Electronics Packaging Society (EPS) San Diego Chapter, in partnership with San Diego State University (SDSU), is pleased to present a three-day summer school focused on the fundamentals and emerging trends in electronic packaging design and characterization. The program is designed for senior undergraduate students, graduate students, recent graduates, and practicing engineers interested in […]
PCB Material Characterization for Measurement-Simulation Correlation - San Diego Section Chapter, EMC27 on 21-July-2026
This talk provides an overview of some prominent laminate material characterization techniques that are crucial for evaluating laminate permittivity and losses. These techniques are compared and contrasted with newer in-situ methodologies that excel at extracting parameters that yield highly accurate measurement-simulation correlation, highlighting where they excel and where they fall short. The talk also demonstrates […]
Computer-Use AI: The Next Interface Layer for Automation - San Diego Section Chapter, C16 on 14-July-2026
5th Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)
Nuclear Power Solution for Energy Demand created by AI Data Centers - San Diego Section Chapter, IA34 on 09-September-2026
Global data center power demand is forecast to rise by 160% to 165% by 2030, with AI driving the majority of this surge. By 2030, worldwide electricity use by data centers is expected to reach 945 TWh. By 2035, demand is projected to soar further to 1,300 TWh globally, with AI making up 70% of […]
San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 5 - San Diego Section Chapter, EP21 on 28-July-2026
We are organizing part5 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting. The agenda is as follows: Next technical lectures About EPS subsidy Webpage development & Linkedin page IMAPS collaboration Ask EPS for merchandise/swag Membership drive Invite student chapters Booth at local events
AI Adoption Exchange – IEEE San Diego (Informal Networking) - San Diego Section Chapter, SP01 on 17-July-2026
How are companies actually adopting AI today? This informal IEEE networking session is designed for engineers, researchers, and industry practitioners to share real-world experiences around AI adoption — what’s working, what’s not, and where teams are facing challenges. This is not a talk or presentation.There are no slides — just a curated, peer-level discussion. Topics […]
IEEE Lecture - Co-Design and Tools for Heterogeneous Integration - Challenges and Opportunities - San Diego Section Chapter, EP21 on 24-July-2026
The advent of artificial intelligence, high-performance computing, data centers, health, automotive and communication is driving the quest for more creative integration methods. Future packaging technologies will exhibit high interconnect densities and large numbers of diverse components and devices. Such schemes are expected to offer relaxed transactions between components, increased bandwidth, and better energy efficiency. To achieve these potentials, the implementation […]